Techincal Specification:
| MAJOR COMPONENTS | MICROELECTRONIC CIRCUIT LM3I9, 316-R002-392, SN74LS279N, SN74LS74N, SN74LS11N,SN74LS10N, SN7407N, SN7404N, SN7402N, SEMICONDUCTOR HA-4602, RELAY W118DIP-5, COMPONENT HEADER ASSEMBLY 13057269, 13057268, 13057267, 13057266, 13057625 | | III PART NAME ASSIGNED BY CONTROLLING AGENCY | ELECTRONIC COMPONENT ASSEMBLY | | PROPRIETARY CHARACTERISTICS | PACS |
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