| BODY HEIGHT | 0.200 INCHES MAXIMUM |
| BODY LENGTH | 1.060 INCHES MAXIMUM |
| BODY WIDTH | 0.310 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| CRITICALITY CODE JUSTIFICATION | CBBL |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND TESTED TO MIL-STD-883 AND PROGRAMMED AND BURN IN, MIL-STD-883, CLASS B AND ERASABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | SILICON |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| MAXIMUM POWER DISSIPATION RATING | 303.0 MILLIWATTS |
| MEMORY DEVICE TYPE | PAL |
| SPECIAL FEATURES | ALTERED ITEM PROGRAMMED USING 67268/5962-8851501RX USING VERSION OR FIRMWARE DESCRIPTION DOCUMENT VDD0236.02..01 |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MCKT,DIGITAL BIPOLAR,PROGRAMMABLEARRAY LOGIC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 4.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |