| BODY HEIGHT | 0.151 INCHES MAXIMUM |
| BODY LENGTH | 4.145 INCHES NOMINAL |
| BODY WIDTH | 2.145 INCHES NOMINAL |
| DESIGN FUNCTION AND QUANTITY | 1 CONTROL |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND W/RESISTOR |
| HYBRID TECHNOLOGY TYPE | MULTICHIP |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| MAXIMUM POWER DISSIPATION RATING | 13.3 WATTS |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | SP, MULTI-CHIP MODULE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC AND TRANSISTOR-TRANSISTOR LOGIC |
| SPECIAL FEATURES | LEADS LOCATED ON ALL FOUR SIDES OF PACKAGE |
| SPECIFICATION/STANDARD DATA | 82577-8655480-001 MANUFACTURERS SOURCE CONTROL |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 442 FLAT LEADS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |