| BODY HEIGHT | 0.161 INCHES MAXIMUM |
| BODY LENGTH | 2.380 INCHES MAXIMUM |
| BODY WIDTH | 2.380 INCHES MAXIMUM |
| DESIGN FUNCTION AND QUANTITY | 1 MEMORY, RANDOM ACCESS |
| FEATURES PROVIDED | DYNAMIC AND ELECTROSTATIC SENSITIVE |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| INCLOSURE MATERIAL | CERAMIC |
| MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| OPERATING TEMP RANGE | -55.0 TO 110.0 CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| SPECIAL FEATURES | 12 MBIT BULK MEMORY |
| SPECIFICATION/STANDARD DATA | 82577-656250-002 MANUFACTURERS SOURCE CONTROL |
| STORAGE TEMP RANGE | -65.0 TO 15.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 156 GULLWING |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |