| BODY HEIGHT | 0.103 INCHES MAXIMUM |
| BODY LENGTH | 2.540 INCHES MAXIMUM |
| BODY WIDTH | 2.540 INCHES MAXIMUM |
| CRITICALITY CODE JUSTIFICATION | CBBL |
| FEATURES PROVIDED | BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMED AND TESTED TO MIL-STD-883 |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| INCLOSURE MATERIAL | CERAMIC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| MEMORY DEVICE TYPE | PAL |
| SPECIAL FEATURES | 112,000 GATE COUNT;TI TBG1000 0.8 MICRON BI-CMOS TECHNOLOGY;FOUR FUNCTIONS-BUS INTERFACE, SYMBOL GENERATOR, SYMBOL OCCLUSION AND SYMBOL SCAN CONVERSION FUNCTIONS;MAX CLOCK FREQUENCY IS 40 MHZ |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, ASIC, DIGITAL, SYMBOL GENERATOR |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 5.0 VOLTS MAXIMUM INPUT AND -0.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 196 BEAM LEAD |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |