| CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| CURRENT RATING PER CHARACTERISTIC | 60.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 650.0 MILLIWATTS |
| MEMORY DEVICE TYPE | PAL |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM ACCESS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |