| BODY HEIGHT | 1.5 MILLIMETERS MINIMUM AND 2.5 MILLIMETERS MAXIMUM |
| BODY LENGTH | 11.2 MILLIMETERS MINIMUM AND 11.7 MILLIMETERS MAXIMUM |
| BODY WIDTH | 11.2 MILLIMETERS MINIMUM AND 11.7 MILLIMETERS MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES NOMINAL TOTAL SUPPLY |
| FEATURES PROVIDED | PROGRAMMED |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| MEMORY DEVICE TYPE | PROM |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM APPLIED |