FEATURES PROVIDED | BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND HIGH PERFORMANCE AND TESTED TO MIL-STD-883 |
INCLOSURE CONFIGURATION | PIN GRID ARRAY |
INCLOSURE MATERIAL | CERAMIC |
OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
MEMORY DEVICE TYPE | PAL |
PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT HIGH PERFORMANCE, MICROCONTROLLERS, CMOS |
PRECIOUS MATERIAL AND LOCATION | TERMINAL LEADS, LID, RING PADS GOLD |
SPECIAL FEATURES | ESD |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM TOTAL AND 0.7 VOLTS MAXIMUM TOTAL |
STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
TERMINAL TYPE AND QUANTITY | 34 PIN |
BODY HEIGHT | 0.078 INCHES MINIMUM AND 0.098 INCHES MAXIMUM |
BODY LENGTH | 0.990 INCHES MINIMUM AND 1.110 INCHES MAXIMUM |
BODY WIDTH | 0.990 INCHES MINIMUM AND 1.110 INCHES MAXIMUM |
CRITICALITY CODE JUSTIFICATION | FEAT |