| BODY HEIGHT | 0.090 INCHES MINIMUM AND 0.130 INCHES MAXIMUM |
| BODY LENGTH | 0.740 INCHES MAXIMUM |
| BODY WIDTH | 0.380 INCHES MINIMUM AND 0.420 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-12 MIL-M-38510 |
| CAPITANCE RATING PER CHARACTERISTIC | 10.00 INPUT PICOFARADS MAXIMUM AND 10.00 OUTPUT PICOFARADS MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES MAXIMUM SUPPLY |
| FEATURES PROVIDED | BIDIRECTIONAL AND W/ENABLE AND W/DISABLE AND PROGRAMMABLE AND MONOLITHIC |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 26 INPUT |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| MEMORY DEVICE TYPE | EEPROM |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.25 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 28 FLAT LEADS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM ACCESS |