| BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.092 INCHES MAXIMUM |
| BODY LENGTH | 0.540 INCHES MAXIMUM |
| BODY WIDTH | 0.250 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-10 MIL-M-38510 |
| CAPITANCE RATING PER CHARACTERISTIC | 7.00 INPUT PICOFARADS MAXIMUM AND 7.00 OUTPUT PICOFARADS MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | 90.00 MILLIAMPERES MAXIMUM SUPPLY |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PARALLEL OPERATION |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 9 INPUT |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM DELAY |