| BODY HEIGHT | 0.100 INCHES MAXIMUM |
| BODY LENGTH | 0.358 INCHES MAXIMUM |
| BODY WIDTH | 0.358 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES NOMINAL OUTPUT SINK |
| DESIGN FUNCTION AND QUANTITY | 8 LATCH, D |
| FEATURES PROVIDED | FAST CARRY AND MONOLITHIC AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 11 INPUT |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| OVERALL HEIGHT | 0.100 INCHES MAXIMUM |
| OVERALL LENGTH | 0.358 INCHES MAXIMUM |
| OVERALL WIDTH | 0.358 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM TOTAL SUPPLY AND 6.0 VOLTS MAXIMUM TOTAL SUPPLY |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |