| BODY HEIGHT | 0.135 INCHES MINIMUM AND 0.150 INCHES MAXIMUM |
| BODY LENGTH | 0.370 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| DESIGN FUNCTION AND QUANTITY | 2 BUFFER |
| FEATURES PROVIDED | HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/BUFFERED OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | PLASTIC |
| INPUT CIRCUIT PATTERN | DUAL 2 INPUT |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| OPERATING TEMP RANGE | -40.0 TO 85.0 CELSIUS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 18.5 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 8 PRINTED CIRCUIT |
| TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |