| MOUNTING METHOD | TERMINAL |
| TERMINAL TYPE AND QUANTITY | 1 BONDING PAD |
| OVERALL LENGTH | 3.3 MILLIMETERS MINIMUM AND |
| 3.6 MILLIMETERS MAXIMUM |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 50.0 MAXIMUM REVERSE VOLTAGE, DC AND |
| 50.0 MAXIMUM NONREPETITIVE PEAK REVERSE VOLTAGE |
| MATERIAL | PLASTIC INCLOSURE |
| SILICON SEMICONDUCTOR |
| CURRENT RATING PER CHARACTERISTIC | 600.0 MILLIAMPERES MAXIMUM FORWARD CURRENT, AVERAGE AND |
| 200.0 MILLIAMPERES MAXIMUM SOURCE CURRENT |
| POWER RATING PER CHARACTERISTIC | 500.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
| OVERALL DIAMETER | 1.5 MILLIMETERS MAXIMUM |
| OVERALL HEIGHT | 1.3 MILLIMETERS MINIMUM AND |
| 1.5 MILLIMETERS MAXIMUM |
| OVERALL WIDTH | 1.3 MILLIMETERS MINIMUM AND |
| 1.5 MILLIMETERS MAXIMUM |
| FUNCTION FOR WHICH DESIGNED | SWITCHING |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND |
| HERMETICALLY SEALED CASE |
| SPECIAL FEATURES | SMALL SURFACE MOUNTING TYPE (LLDS); HIGH SPEED, HIGH RELIABILITY; STORAGE TEMPERATURE -65.0 TO 200.0 C. |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | DIODE, SWITCHING |