| MOUNTING METHOD | TERMINAL |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| OVERALL LENGTH | 0.150 INCHES MINIMUM AND |
| 0.170 INCHES MAXIMUM |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| MATERIAL | GLASS INCLOSURE |
| SILICON SEMICONDUCTOR |
| CURRENT RATING PER CHARACTERISTIC | 30.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS NOMINAL FORWARD POWER DISSIPATION, DC |
| CAPACITANCE RATING IN PICOFARADS | 0.3 MAXIMUM |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | 15 |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| TERMINAL CIRCLE DIAMETER | 0.4 MILLIMETERS NOMINAL |
| OVERALL DIAMETER | 0.064 INCHES MINIMUM AND |
| 0.070 INCHES MAXIMUM |
| FUNCTION FOR WHICH DESIGNED | GENERAL PURPOSE |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| SPECIAL FEATURES | LEAD FINISH IS 95-5 TIN-LEAD; LEADS ARE RESTRICTED SO THAT THE BEND STARTS AT LEAST 1/16 IN. FROM THE GLASS BODY; EFFECTIVE CARRIER LIFETIME: 100 NS (MIN); MAX. RESIDUAL SERIES RESISTANCE: 15 OHMS; HIGH RESISTANCE LIMIT: 1100-1660 OHMS; LOW RESISTANCE LIMIT: 10-24 OHMS; MAX. SOLDERING TEMP: 250 DEG C FOR 5 SEC |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | PIN DIODE FOR RF SWITCHING AND ATTENUATING |