| MOUNTING METHOD | TERMINAL |
| TERMINAL TYPE AND QUANTITY | 8 BONDING PAD |
| OVERALL LENGTH | 0.189 INCHES MINIMUM AND |
| 0.197 INCHES MAXIMUM |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 4.8 MINIMUM REVERSE BREAKDOWN VOLTAGE, DC AND |
| 5.2 MAXIMUM REVERSE BREAKDOWN VOLTAGE, DC |
| MATERIAL | PLASTIC INCLOSURE |
| SILICON SEMICONDUCTOR |
| CURRENT RATING PER CHARACTERISTIC | 15.00 MILLIAMPERES MAXIMUM REVERSE CURRENT, DC AND |
| 10.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SO-8 |
| OVERALL HEIGHT | 0.053 INCHES MINIMUM AND |
| 0.069 INCHES MAXIMUM |
| OVERALL WIDTH | 0.228 INCHES MINIMUM AND |
| 0.244 INCHES MAXIMUM |
| SPECIAL FEATURES | GULLWING LEADS |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | 5.0V REFERENCE DIODE |