|
|
|
National Stock Number:
5961-01-411-0312
Federal Supply Class:
5961
National Item Identification Number:
014110312
Description:
SEMICONDUCTOR DEVICES,UNITIZED
Detail:
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.
|
Manufacturer Information:
| 10129842 | A486G | NIMIKKEISTOKESKUS NCB FINLAND | | 2037AS362-01 | 0NNS4 | LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN SIMULATION TRAINING & SUPPORT | | 2037AS362-01 | 30003 | NAVAL AIR SYSTEMS COMMAND MANAGED ORIGINAL DESIGN ACTIVITY NOT MATERIAL/PARTS SUPPLIER | | HSMS-2805-BLKG | 50434 | AVAGO TECHNOLOGIES US INC | | HSMS-2805T | 50434 | AVAGO TECHNOLOGIES US INC | | 91843145 | F6481 | THALES SA | | HSMS-2805T | 54893 | HEWLETT-PACKARD CO COMMUNICATIONS COMPONENTS/AVANTEK DIV |
|
Techincal Specification:
| COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE | | CURRENT RATING PER CHARACTERISTIC | 1.00 AMPERES MAXIMUM FORWARD CURRENT, MAXIMUM PEAK TOTAL VALUE ALL SEMICONDUCTOR DEVICE DIODE | | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SOT-143 | | OVERALL HEIGHT | 1.1 MILLIMETERS MAXIMUM | | OVERALL LENGTH | 3.0 MILLIMETERS MAXIMUM | | OVERALL WIDTH | 2.5 MILLIMETERS MAXIMUM | | MATERIAL | PLASTIC ENCLOSURE | | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 CELSIUS AMBIENT AIR | | MOUNTING METHOD | TERMINAL | | POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE | | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE | | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 70.0 MAXIMUM REVERSE VOLTAGE, PEAK ALL SEMICONDUCTOR DEVICE DIODE | | TERMINAL TYPE AND QUANTITY | 4 PRINTED CIRCUIT | | TEST DATA DOCUMENT | 30003-2037AS362 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
|
|