| MOUNTING METHOD | TERMINAL |
| TERMINAL TYPE AND QUANTITY | 3 BONDING PAD |
| OVERALL LENGTH | 0.1102 INCHES MINIMUM AND |
| 0.1197 INCHES MAXIMUM |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 22.2 NOMINAL NOMINAL REGULATOR VOLTAGE |
| MATERIAL | PLASTIC INCLOSURE |
| SILICON SEMICONDUCTOR |
| VOLTAGE TOLERANCE IN PERCENT | -5.0 TO 5.0 |
| POWER RATING PER CHARACTERISTIC | 300.0 MILLIWATTS MAXIMUM OFF-STATE POWER DISSIPATION |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| OVERALL HEIGHT | 0.0315 INCHES MINIMUM AND |
| 0.0472 INCHES MAXIMUM |
| OVERALL WIDTH | 0.0827 INCHES MINIMUM AND |
| 0.0984 INCHES MAXIMUM |
| FUNCTION FOR WHICH DESIGNED | ZENER DIODE |