| MOUNTING METHOD | PRESS FIT |
| TERMINAL TYPE AND QUANTITY | 2 CASE |
| OVERALL LENGTH | 2.92 MILLIMETERS MINIMUM AND |
| 3.81 MILLIMETERS MAXIMUM |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 70.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| MATERIAL | CERAMIC INCLOSURE |
| SILICON SEMICONDUCTOR |
| CURRENT RATING PER CHARACTERISTIC | 1.00 MICROAMPERES MAXIMUM REVERSE CURRENT, DC |
| POWER RATING PER CHARACTERISTIC | 500.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| CAPACITANCE RATING IN PICOFARADS | 1.1 MAXIMUM |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
| OVERALL HEIGHT | 1.50 MILLIMETERS MINIMUM AND |
| 2.41 MILLIMETERS MAXIMUM |
| OVERALL WIDTH | 1.50 MILLIMETERS MINIMUM AND |
| 2.41 MILLIMETERS MAXIMUM |
| TEST DATA DOCUMENT | 80063-A3132209 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |