| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-5 |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| III SEMICONDUCTOR MATERIAL | SILICON |
| INCLOSURE MATERIAL | METAL |
| POWER RATING PER CHARACTERISTIC | 800.0 MILLIWATTS ANY ACCEPTABLE PRESET |
| PROPRIETARY CHARACTERISTICS | PACS |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
| MOUNTING METHOD | TERMINAL |
| OVERALL DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| OVERALL LENGTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 160.0 NOMINAL COLLECTOR TO EMITTER SATURATION VOLTAGE AND 4.0 NOMINAL EMITTER TO BASE VOLTAGE, DC |
| TERMINAL CIRCLE DIAMETER | 0.200 INCHES NOMINAL |
| TERMINAL LENGTH | 0.250 INCHES MINIMUM |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |