| MOUNTING METHOD | PRESS FIT |
| TERMINAL TYPE AND QUANTITY | 1 BONDING PAD |
| OVERALL LENGTH | 0.38 MILLIMETERS NOMINAL |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 20.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| MATERIAL | SILICON SEMICONDUCTOR |
| CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES MINIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| POWER RATING PER CHARACTERISTIC | 100.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| CAPACITANCE RATING IN PICOFARADS | 0.4 MAXIMUM |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
| OVERALL HEIGHT | 0.13 MILLIMETERS NOMINAL |
| OVERALL WIDTH | 0.38 MILLIMETERS NOMINAL |
| FUNCTION FOR WHICH DESIGNED | FREQUENCY MULTIPLIER |
| PRECIOUS MATERIAL | GOLD |
| PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |