| COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| CURRENT RATING PER CHARACTERISTIC | 20.00 MILLIAMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE ALL SEMICONDUCTOR DEVICE DIODE |
| OVERALL HEIGHT | 0.030 INCHES MINIMUM AND 0.040 INCHES MAXIMUM |
| OVERALL LENGTH | 0.072 INCHES MINIMUM AND 0.078 INCHES MAXIMUM |
| OVERALL WIDTH | 0.037 INCHES MINIMUM AND 0.043 INCHES MAXIMUM |
| MOUNTING METHOD | TERMINAL |
| SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| PRECIOUS MATERIAL AND LOCATION | EUTECTIC DIE BONDS SURFACES TERMINALS AND LAND AREAS SURFACES GOLD |
| PRECIOUS MATERIAL | GOLD |
| SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 60.0 MAXIMUM REVERSE VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE |
| TERMINAL TYPE AND QUANTITY | 4 BONDING PAD |