5961-01-308-6670, SEMICONDUCTOR DEVICES,UNITIZED

5980-01-308-6669 SEMICONDUCTOR DEVICES,UNITIZED

National Stock Number:
5961-01-308-6670

Federal Supply Class:
5961

National Item Identification Number:
013086670

Description:
SEMICONDUCTOR DEVICES,UNITIZED

Detail:
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Manufacturer Information:

JAN1N5772	81349	MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M
MIL-PRF-19500/474	81349	MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M
MIL-S-19500/474	81349	MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

Techincal Specification:

COMPONENT NAME AND QUANTITY	8 SEMICONDUCTOR DEVICE DIODE
CURRENT RATING PER CHARACTERISTIC	300.00 MILLIAMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 50-HZ CYCLE ALL SEMICONDUCTOR DEVICE DIODE
INCLOSURE MATERIAL	METAL
OVERALL HEIGHT	0.030 INCHES MINIMUM AND 0.085 INCHES MAXIMUM
OVERALL LENGTH	0.290 INCHES MAXIMUM
OVERALL WIDTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
MOUNTING METHOD	TERMINAL
SEMICONDUCTOR MATERIAL	SILICON ALL SEMICONDUCTOR DEVICE DIODE
POWER RATING PER CHARACTERISTIC	500.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE
TEST DATA DOCUMENT	81349-MIL-S-19500 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.).
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC	60.0 MAXIMUM REVERSE BREAKDOWN VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE
SPECIFICATION/STANDARD DATA	81349-MIL-S-19500/474 GOVERNMENT SPECIFICATION
TERMINAL CIRCLE DIAMETER	0.010 INCHES MINIMUM AND 0.019 INCHES MAXIMUM
TERMINAL LENGTH	0.240 INCHES MINIMUM AND 0.370 INCHES MAXIMUM
TERMINAL TYPE AND QUANTITY	10 PIN

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