5961-01-157-8441 TRANSISTOR Index 5961-01-157-8443 SEMICONDUCTOR DEVICE,DIODE

National Stock Number:
5961-01-157-8442

Federal Supply Class:
5961

National Item Identification Number:
011578442

Description:
SEMICONDUCTOR DEVICES,UNITIZED

Detail:
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.


Manufacturer Information:
1A8129-197953GE AVIATION SYSTEMS LLC
20-01021-00100724RAYTHEON COMPANY
932455-106481NORTHROP GRUMMAN SYSTEMS CORPORATION
41-1001-0809062CRANE ELECTRONICS, INC.
95-423959993INTERNATIONAL RECTIFIER CORPORATION USE CAGE CODE 81483 FOR CATALOGING
95-423981483INFINEON TECHNOLOGIES AMERICAS CORP
SD24101281TRW ELECTRONICS AND DEFENSE SECTOR RF DEVICES
SD241R01281TRW ELECTRONICS AND DEFENSE SECTOR RF DEVICES
MBR3045CT04713FREESCALE SEMICONDUCTOR, INC.
SD-24A32694OPTEK TECHNOLOGY, INC
SD24143611MICROSEMI CORP - MASSACHUSETTS
SD-24159377MICROSEMI CORP-COLORADO
D835259377MICROSEMI CORP-COLORADO
A302826480063US ARMY COMMUNICATIONS & ELECTRONICS MATERIEL READINESS COMMAND LOGISTICS ENGINEERING DIR
SD242801281TRW ELECTRONICS AND DEFENSE SECTOR RF DEVICES
SES58231338SEMITRONICS CORP


Techincal Specification:
COMPONENT NAME AND QUANTITY2 SEMICONDUCTOR DEVICE DIODE
CURRENT RATING PER CHARACTERISTIC30.00 AMPERES FORWARD CURRENT, AVERAGE ABSOLUTE ALL SEMICONDUCTOR DEVICE DIODE
FEATURES PROVIDEDHERMETICALLY SEALED CASE
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATIONTO-3
INCLOSURE MATERIALMETAL
PROPRIETARY CHARACTERISTICSPACS
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT150.0 DEG CELSIUS AMBIENT AIR
MOUNTING FACILITY QUANTITY2
MOUNTING METHODUNTHREADED HOLE
OVERALL HEIGHT0.250 INCHES MINIMUM AND 0.450 INCHES MAXIMUM
OVERALL LENGTH1.439 INCHES MINIMUM AND 1.573 INCHES MAXIMUM
OVERALL WIDTH0.990 INCHES MINIMUM AND 1.050 INCHES MAXIMUM
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN
SEMICONDUCTOR MATERIALSILICON ALL SEMICONDUCTOR DEVICE DIODE
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC45.0 MAXIMUM REVERSE VOLTAGE, PEAK ALL SEMICONDUCTOR DEVICE DIODE
TERMINAL TYPE AND QUANTITY2 PIN AND 1 CASE


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