| III SEMICONDUCTOR MATERIAL | SILICON |
| PROPRIETARY CHARACTERISTICS | PACS |
| MOUNTING METHOD | CLIP |
| OVERALL HEIGHT | 7.120 MILLIMETERS MINIMUM AND 8.120 MILLIMETERS MAXIMUM |
| OVERALL LENGTH | 9.150 MILLIMETERS MINIMUM AND 10.410 MILLIMETERS MAXIMUM |
| OVERALL WIDTH | 3.050 MILLIMETERS MINIMUM AND 4.820 MILLIMETERS MAXIMUM |
| SPECIAL FEATURES | AREA STRAIGHT ABOVE HOLE SHALL BENOTCHED OUT |
| TERMINAL LENGTH | 9.430 MILLIMETERS MINIMUM AND 13.200 MILLIMETERS MAXIMUM |
| TERMINAL TYPE AND QUANTITY | 3 PIN |