| ACCOMMODATED CONTACT QUANTITY | 8 |
| BODY MATERIAL | PLASTIC |
| BODY MOUNTING HOLE ACCOMMODATION DIAMETER | 0.370 INCHES MINIMUM AND 0.375 INCHES MAXIMUM |
| BODY STYLE | TOP MOUNT, PRESS FIT |
| CONTACT MAXIMUM CURRENT RATING IN AMPS | 1.0 |
| CONTACT MATERIAL | BERYLLIUM COPPER |
| CONTACT POSITION ARRANGEMENT STYLE | CIRCULAR .230 INCH |
| CONTACT RESISTANCE IN OHMS | 0.009 |
| CONTACT SURFACE TREATMENT | GOLD AND NICKEL |
| FABRICATION METHOD | MOLDED |
| OVERALL DIAMETER | 0.390 INCHES MINIMUM AND 0.410 INCHES MAXIMUM |
| OVERALL HEIGHT | 0.544 INCHES MINIMUM AND 0.626 INCHES MAXIMUM |
| MOUNTING METHOD | PRESS FIT |
| MOUNTING HOLE STYLE | ROUND, BODY |
| MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |
| POLARIZATION TYPE | SLOT |
| PRECIOUS MATERIAL AND LOCATION | C0NTACT SURFACES GOLD |
| PRECIOUS MATERIAL AND WEIGHT | 0.008 GOLD GRAINS, TROY |
| PRECIOUS MATERIAL | GOLD |
| PROJECTION LENGTH ABOVE MOUNTING SURFACE | 0.062 INCHES NOMINAL |
| SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |
| TEMP RATING | -65.0 DEG CELSIUS AND 150.0 DEG CELSIUS |
| TERMINAL LENGTH | 0.286 INCHES MINIMUM AND 0.348 INCHES MAXIMUM |
| TERMINAL TYPE AND QUANTITY | 8 PRINTED CIRCUIT |