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National Stock Number:
5935-00-878-7482
Federal Supply Class:
5935
National Item Identification Number:
008787482
Description:
SOCKET,PLUG-IN ELECTRONIC COMPON
Detail:
An item designed to electrically connect and mechanically position the base of an item having plug-in-type contacts, and to facilitate replacement of the item accommodated. It includes sockets which accommodate the contacts of capacitors, coils, crystals, electron tubes, relays, semiconductor devices and vibrators. Excludes sockets or receptacles designed to accommodate plug-in component circuit boards (printed circuit boards) and electronic modules or sub-assemblies. Also excludes heat-dissipating (not heat-sinks) sockets for mounting power transistors.
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Manufacturer Information:
| 133-14-01-011 | 71785 | CINCH CONNECTIVITY SOLUTIONS INC. | | 212607 | 09017 | EDO | | 9157288 | 18876 | U S ARMY AVIATION AND MISSILE COMMAND | | 24872 | 71785 | CINCH CONNECTIVITY SOLUTIONS INC. | | 2TS-4 | 71785 | CINCH CONNECTIVITY SOLUTIONS INC. |
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Techincal Specification:
| CONTACT POSITION ARRANGEMENT STYLE | IRREGULAR | | ACCOMMODATED CONTACT QUANTITY | 4 | | TERMINAL TYPE AND QUANTITY | 4 TAB, SOLDER LUG | | BODY STYLE | TOP OR BOTTOM MOUNT W/MOLDED SADDLE | | CONTACT MATERIAL | PHOSPHOR BRONZE | | CONTACT SURFACE TREATMENT | CADMIUM | | OVERALL LENGTH | 0.805 INCHES MINIMUM AND | | 0.815 INCHES MAXIMUM | | OVERALL HEIGHT | 0.554 INCHES NOMINAL | | OVERALL WIDTH | 0.395 INCHES MINIMUM AND | | 0.405 INCHES MAXIMUM | | PROJECTION LENGTH ABOVE MOUNTING SURFACE | 0.095 INCHES MINIMUM AND | | 0.105 INCHES MAXIMUM | | BODY MATERIAL | PLASTIC | | MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS | | MOUNTING METHOD | SADDLE | | MOUNTING HOLE STYLE | ROUND, W/TWO MOUNTING HOLES | | MOUNTING HOLE DIAMETER | 0.096 INCHES MINIMUM AND | | 0.106 INCHES MAXIMUM | | BODY MOUNTING HOLE ACCOMMODATION DIAMETER | 0.400 INCHES NOMINAL | | DISTANCE BETWEEN MOUNTING FACILITY CENTERS | 0.585 INCHES MINIMUM AND | | 0.595 INCHES MAXIMUM | | POLARIZATION TYPE | CONTACT POSITION | | SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR | | FABRICATION METHOD | MOLDED | | SADDLE MATERIAL | PLASTIC |
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