| ACCOMMODATED CONTACT QUANTITY | 3 |
| BODY MOUNTING HOLE ACCOMMODATION LENGTH | 0.360 INCHES NOMINAL |
| BODY MOUNTING HOLE ACCOMMODATION WIDTH | 0.195 INCHES MINIMUM AND 0.205 INCHES MAXIMUM |
| BODY STYLE | PRESS FIT |
| CONTACT MAXIMUM CURRENT RATING IN AMPS | 1.0 |
| CONTACT POSITION ARRANGEMENT STYLE | IN LINE |
| CONTACT RESISTANCE IN OHMS | 0.030 |
| FABRICATION METHOD | MOLDED |
| OVERALL HEIGHT | 0.469 INCHES NOMINAL |
| OVERALL LENGTH | 0.345 INCHES MINIMUM AND 0.355 INCHES MAXIMUM |
| OVERALL WIDTH | 0.218 INCHES NOMINAL |
| MOUNTING HOLE STYLE | RECTANGULAR |
| MOUNTING METHOD | PRESS FIT |
| MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |
| POLARIZATION TYPE | OFF CENTER HOLE |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD AND CONTACT SURFACES SILVER |
| PRECIOUS MATERIAL AND WEIGHT | 0.003 GOLD GRAINS, TROY AND 0.003 SILVER GRAINS, TROY |
| PRECIOUS MATERIAL | GOLD AND SILVER |
| PROJECTION LENGTH ABOVE MOUNTING SURFACE | 0.062 INCHES NOMINAL |
| SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |
| TERMINAL TYPE AND QUANTITY | 3 PIN |