| BODY HEIGHT | 1.4 MILLIMETERS MINIMUM AND 1.8 MILLIMETERS MAXIMUM |
| BODY LENGTH | 3.5 MILLIMETERS MINIMUM AND 3.9 MILLIMETERS MAXIMUM |
| BODY STYLE | CHIP TYPE |
| BODY WIDTH | 1.7 MILLIMETERS MINIMUM AND 2.1 MILLIMETERS MAXIMUM |
| CAPACITANCE VALUE PER SECTION | 10.000 NANOFARADS SINGLE SECTION |
| DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 2.500 |
| INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 10000.0 MEGOHMS |
| INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| MATERIAL | CERAMIC CASE |
| NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 200.0 DC SINGLE SECTION |
| NONDERATED OPERATING TEMP | -55.0 CELSIUS MINIMUM AND 125.0 CELSIUS MAXIMUM |
| RELIABILITY INDICATOR | NOT ESTABLISHED |
| SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| TERMINAL LENGTH | 0.2 MILLIMETERS MINIMUM AND 0.7 MILLIMETERS MAXIMUM |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| TOLERANCE RANGE PER SECTION | -10.00 TO 10.00 PERCENT SINGLE SECTION |